What method is recommended for safely removing thermal compound?

The recommended method for safely removing thermal compound is using isopropyl alcohol wipes or a cotton swab dipped in isopropyl alcohol. This approach is effective because isopropyl alcohol is a solvent that can dissolve thermal compounds without leaving residues that could interfere with proper thermal conductivity when applying new thermal paste. It also evaporates quickly, minimizing the risk of moisture damage to electronic components.

Using a dry cloth only may not effectively remove thermal compound, as the residue can be sticky and may require a solvent for proper cleaning. Warm water and cloth or petroleum jelly wipes are not suitable choices, as they can introduce moisture or additional substances that may not evaporate, potentially harming sensitive components or leading to ineffective thermal transfer upon reapplication of a new thermal interface.