What is the recommended method for applying thermal compound in desktop form factors?

The recommended method for applying thermal compound in desktop form factors is to place a pea-sized dab in the middle of the processor. This technique allows for adequate thermal transfer while minimizing the risk of excess compound spilling over the edges, which can potentially cause short circuits.

When the processor heats up, the thermal compound will spread out evenly under pressure from the heat sink. This ensures that there is a thin, even layer of compound covering the necessary surfaces, allowing for optimal heat dissipation. Unlike spreading the compound with a spatula or a brush, which could introduce air bubbles or lead to uneven layers, the pea-sized dab method is a simpler approach that effectively utilizes the thermal compound's properties without over-applying.

Using recommendations like coating the entire surface or spreading it manually can lead to complications such as waste of material or improper thermal conductivity, making the pea-sized dab the most effective and widely accepted method among service technicians.