What is the primary function of thermal paste?

The primary function of thermal paste is to fill gaps and enhance thermal conductivity between a CPU or GPU and its heat sink. When these components are manufactured, there may be microscopic imperfections or air gaps present on their surfaces. Air is a poor conductor of heat, so if any gaps remain between the heat-generating component and the heat sink, it can lead to inefficient heat dissipation and potentially result in overheating.

By applying thermal paste, it helps to create a more uniform, conductive surface that allows for better heat transfer from the processor to the heat sink. This is critical for maintaining optimal operating temperatures and ensuring the longevity and performance of the hardware. Proper application of thermal paste can significantly improve thermal performance, making it a crucial step in assembling or maintaining computer hardware.

The other options are focused on different functions that do not pertain to the thermal management aspect of computer systems. For example, isolating electric components or acting as a lubricant for screws does not aid in maintaining the necessary temperatures for optimal performance in hardware. Likewise, sealing against moisture does not relate to heat transfer but instead focuses on the physical protection of components.