What is the general rule about thermal compound application?

The correct guideline for applying thermal compound is that only a small amount is necessary. The purpose of thermal compound is to fill in microscopic gaps between the CPU (or GPU) and the heat sink, allowing for better thermal conductivity. Excess thermal compound can actually hinder heat transfer rather than improve it, as it can create a layer that acts as an insulator.

Applying too much thermal paste can also lead to spillage, which could potentially cause damage to the surrounding components. The ideal application technique is to use just enough to cover the surface, typically a small pea-sized amount or a thin line that spreads evenly when the heat sink is installed. This ensures optimal contact and thermal transfer without creating excess that could cause issues.

By adhering to this principle, technicians can maximize cooling efficiency and maintain the longevity and performance of the components involved.