What is the appropriate method for applying thermal compound on a laptop?

Applying thermal compound is a critical step in ensuring efficient heat transfer between the CPU or GPU and the heatsink, which is essential for maintaining optimal operating temperatures in a laptop. The correct choice involves spreading the thermal compound until the entire surface is covered. This method ensures that there is a uniform layer of thermal compound, which fills in microscopic imperfections between the surfaces of the processor and the heatsink.

When heat is generated by the processor, the thermal compound facilitates effective heat dissipation by providing a better thermal interface than air, which is trapped in any gaps. A fully covered surface allows for maximum thermal conductivity, minimizing the chances of overheating and ensuring that the laptop operates within safe temperature ranges.

While other options might seem straightforward, they do not provide the same level of coverage or effectiveness. For instance, applying a large blob in the center might lead to spillage when the heatsink is mounted, creating uneven coverage. A small dot in the corner does not adequately cover the surface area needed for effective heat transfer. Opting out of applying thermal compound entirely would significantly increase the risk of overheating and potentially damage the internal components. Thus, spreading the compound ensures that it performs its function properly, leading to a cooler and more reliable system.